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Solvent Resistance of Parylene

The parylenes resist attack and are insoluble in all organic solvents up  to 150ºC. Parylene C can be dissolved in chloro-naphthalene at 175ºC and  parylene N is soluble at the solvent boiling point of 265ºC. Both polymers are  resistant to permeation by most solvents with the exception of aromatic  hydrocarbons. They are also unaffected by stress-cracking agents such as  "Hostepal," "Igepal" and lemon oil.

The effect of a wide variety of  organic solvents on parylenes N, C and D was investigated.

Six classes of  organic solvents were examined: alcohol (isopropyl), ketones (acetone and  2,4-pentanedione), aliphatic hydrocarbon (iso-octane), aromatic hydrocarbon  (xylene), chlorinated olefin (trichloroethylene), chlorinated aromatic  (chlorobenzene and o-dichlorobenzine), heterocyclic base (pyridene), and  fluorinated solvent (trichlorotrifluoroethane).

These solvents had a  minor swelling effect on the parylenes with a 3% maximum increase in film  thickness. The swelling was found to be completely reversible after the solvents  were removed by vacuum drying.

Some inorganic reagents were also  examined. These included: deionized water; 10% solutions of sodium hydroxide and  ammonium hydroxide; non-oxidizing acids, hydrochloric and sulfuric, in  concentrated and 10% solutions; and oxidizing acids, nitric and chromic,  concentrated and 10% solutions.

The diluted inorganic reagents had little  effect on the parylenes. The acids at 10% concentrations had virtually no effect  at room temperature and, except for chromic, no effect at 75ºC. Concentrated  acids at room temperature (23ºC) had little effect. Under severe conditions,  75ºC for 30 minutes, all acids had a measurable effect ranging from 0.7%  swelling with hydrochloric to 8.2% with chromic. Additionally, nitric acid under  these same severe conditions caused severe degradation. Both concentrated nitric and sulfuric acids caused some discoloration.

Earlier experience had  indicated that parylenes N, C and D were insoluble in all common solvents.  Parylene C, it was found, could be dissolved in high boiling liquids such as  X-chloronaphthelene or benzoyl benzoate at temperatures above 150ºC. However,  these solvents are seldom encountered in the electronic industry. Of greater  importance are those solvents and reagents used in processing, especially in  cleaning of components and assemblies. This study was undertaken to  quantitatively measure the effect of the more common solvents and reagents on  the parylenes. Included also were certain hydrocarbons serving as models for  fuels. The organic liquids chosen for this study were selected as being  representative of typical solvent classes. The protection provided to the coated  substrates by the parylenes was also observed.

It was also known that the  parylenes were inert to inorganic reagents (except for oxidizing agents). This  conclusion was confirmed by the work reported here and quantitative results  given.

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